TGV填孔電鍍

商品名稱:

TGV填孔電鍍 (持續開發中)

規格介紹:

TGV填孔電鍍（持續開發中）

TGV Via Filling Electroplating (Under Development)

高導通性微孔填充技術

High-Conductivity Micro-Via Filling Technology

詳細介紹:

TGV填孔電鍍為高密度玻璃貫穿孔（TGV）封裝的關鍵技術

專注於微孔填充電鍍，提升導通性與結構強度

廣泛應用於高頻高速傳輸、5G、HPC與光電元件

TGV via filling electroplating is a key technology for high-density Through-Glass Via (TGV) packaging.
Focused on micro-via filling processes, it enhances electrical conductivity and structural reliability, making it suitable for high-frequency and high-speed applications such as 5G, HPC, and optoelectronic devices.


目前仍持續開發中
This technology is currently under continuous development.

Glass 蝕刻孔徑＋雙面電鍍填孔
Glass Through-Hole Etching & Double-Sided Plating Fill
● Hole Diameter: 1:10 (Total Depth to Diameter)

【5X】
英格特檢驗 直徑50um、深度500um(20x).png
【20X】
英格特檢驗 直徑50um、深度500um(20x).png
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TGV孔徑蝕刻開發中，現階段經由配合廠商提供
玻璃蝕刻後真圓度如下圖：

TGV via etching is currently under development.
At this stage, etched glass vias are provided through our partner suppliers.

The roundness performance of the etched glass vias is shown below:

1-TGV填孔電鍍.png
2-TGV填孔電鍍.png
3-TGV填孔電鍍.png
4-TGV填孔電鍍.png

Glass 蝕刻孔徑＋雙面電鍍填孔
Glass Via Etching + Double-Sided Via Filling Electroplating

TGV填孔後，非破壞性檢驗，填孔結果有無包孔
Non-destructive inspection after TGV via filling to evaluate void formation and filling quality

5-TGV填孔電鍍.png

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